Paper
24 May 2012 Novel methodology to determine thermal conductivity of thermoelectric materials and comparison with device performance
Jay R. Maddux, Patrick J. Taylor
Author Affiliations +
Abstract
Accuracy of thermal conductivity measurements is an ongoing area of controversy in thermoelectric materials development. In this work, we demonstrate a novel steady-state method for characterizing thermal conductivity of bulk materials and devices under isothermal and near-isothermal conditions. The isothermal condition is achieved by exactly balancing Peltier heat flow against an externally imposed heat flow in the material. Under steady-state, isothermal conditions, heat flow in the material can be determined with high accuracy because external parasitic heat flows become negligible. We compare our results with conventional measurement techniques and also with measured thermoelectric device performance. Agreement between predicted and measured thermoelectric cooler performance is within 2%. Results for thermoelectric power generators will also be discussed.
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Jay R. Maddux and Patrick J. Taylor "Novel methodology to determine thermal conductivity of thermoelectric materials and comparison with device performance", Proc. SPIE 8377, Energy Harvesting and Storage: Materials, Devices, and Applications III, 83770I (24 May 2012); https://doi.org/10.1117/12.921346
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KEYWORDS
Thermoelectric materials

Resistance

Heat flux

Lead

Temperature metrology

Copper

Thermal effects

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