Paper
26 March 2013 Direct-write maskless lithography using patterned oxidation of Si-substrate Induced by femtosecond laser pulses
Amirkianoosh Kiani, Krishnan Venkatakrishnan, Bo Tan
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Abstract
In this study we report a new method for direct-write maskless lithography using oxidized silicon layer induced by high repetition (MHz) ultrafast (femtosecond) laser pulses under ambient condition. The induced thin layer of predetermined pattern can act as an etch stop during etching process in alkaline etchants such as KOH. The proposed method can be leading to promising solutions for direct-write maskless lithography technique since the proposed method offers a higher degree of flexibility and reduced time and cost of fabrication which makes it particularly appropriate for rapid prototyping and custom scale manufacturing. A Scanning Electron Microscope (SEM), Micro-Raman, Energy Dispersive X-ray (EDX), optical microscope and X-ray diffraction spectroscopy (XRD) were used to evaluate the quality of oxidized layer induced by laser pulses.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Amirkianoosh Kiani, Krishnan Venkatakrishnan, and Bo Tan "Direct-write maskless lithography using patterned oxidation of Si-substrate Induced by femtosecond laser pulses", Proc. SPIE 8680, Alternative Lithographic Technologies V, 868024 (26 March 2013); https://doi.org/10.1117/12.2006399
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KEYWORDS
Silicon

Etching

Semiconductor lasers

Femtosecond phenomena

Micro raman spectroscopy

Maskless lithography

Scanning electron microscopy

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