Thermographic in-situ process monitoring of the electron-beam melting technology used in additive manufacturing

Ralph B. Dinwiddie; Ryan R Dehoff; Peter D. Lloyd; Larry E. Lowe; Joe B. Ulrich

doi:10.1117/12.2018412

22 May 2013 Thermographic in-situ process monitoring of the electron-beam melting technology used in additive manufacturing

Ralph B. Dinwiddie, Ryan R Dehoff, Peter D. Lloyd, Larry E. Lowe, Joe B. Ulrich

Author Affiliations +

Proceedings Volume 8705, Thermosense: Thermal Infrared Applications XXXV; 87050K (2013) https://doi.org/10.1117/12.2018412
Event: SPIE Defense, Security, and Sensing, 2013, Baltimore, Maryland, United States

Abstract

Oak Ridge National Laboratory (ORNL) has been utilizing the ARCAM electron beam melting technology to additively manufacture complex geometric structures directly from powder. Although the technology has demonstrated the ability to decrease costs, decrease manufacturing lead-time and fabricate complex structures that are impossible to fabricate through conventional processing techniques, certification of the component quality can be challenging. Because the process involves the continuous deposition of successive layers of material, each layer can be examined without destructively testing the component. However, in-situ process monitoring is difficult due to metallization on inside surfaces caused by evaporation and condensation of metal from the melt pool. This work describes a solution to one of the challenges to continuously imaging inside of the chamber during the EBM process. Here, the utilization of a continuously moving Mylar film canister is described. Results will be presented related to in-situ process monitoring and how this technique results in improved mechanical properties and reliability of the process.

Citation Download Citation

Ralph B. Dinwiddie, Ryan R Dehoff, Peter D. Lloyd, Larry E. Lowe, and Joe B. Ulrich "Thermographic in-situ process monitoring of the electron-beam melting technology used in additive manufacturing", Proc. SPIE 8705, Thermosense: Thermal Infrared Applications XXXV, 87050K (22 May 2013); https://doi.org/10.1117/12.2018412

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available