Three-dimensional measurement and characterization of grinding tool topography

Changcai Cui; Liam Blunt; Xiangqian Jiang; Xipeng Xu; Hui Huang; Ruifang Ye

doi:10.1117/12.2015004

31 January 2013 Three-dimensional measurement and characterization of grinding tool topography

Changcai Cui, Liam Blunt, Xiangqian Jiang, Xipeng Xu, Hui Huang, Ruifang Ye

Proceedings Volume 8759, Eighth International Symposium on Precision Engineering Measurement and Instrumentation; 87590Q (2013) https://doi.org/10.1117/12.2015004
Event: International Symposium on Precision Engineering Measurement and Instrumentation 2012, 2012, Chengdu, China

Abstract

A comprehensive 3-dimensional measurement and characterization method for grinding tool topography was developed. A stylus instrument (SOMICRONIC, France) was used to measure the surface of a metal-bonded diamond grinding tool. The sampled data was input the software SurfStand developed by Centre for Precision Technology (CPT) for reconstruction and further characterization of the surface. Roughness parameters pertaining to the general surface and specific feature parameters relating to the grinding grits, such as height and angle peak curvature have been calculated. The methodology of measurement has been compared with that using an optical microscope. The comparison shows that the three-dimensional characterization has distinct advantages for grinding tool topography assessment. It is precise, convenient and comprehensive so it is suitable for precision measurement and analysis where an understanding of the grinding tool and its cutting ability are required.

Citation Download Citation

Changcai Cui, Liam Blunt, Xiangqian Jiang, Xipeng Xu, Hui Huang, and Ruifang Ye "Three-dimensional measurement and characterization of grinding tool topography", Proc. SPIE 8759, Eighth International Symposium on Precision Engineering Measurement and Instrumentation, 87590Q (31 January 2013); https://doi.org/10.1117/12.2015004

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