Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping

Erik Zucker; Daniel Zou; Laura Zavala; Hongbo Yu; Prasad Yalamanchili; Lei Xu; Hui Xu; David Venables; Jay Skidmore; Victor Rossin; Reddy Raju; Matthew Peters; Kai-Hsiu Liao; Kong-Weng Lee; Boris Kharlamov; Allen Hsieh; Rupa Gurram; James Guo; Nicolas Guerin; Jeff Gregg; Richard Duesterberg; Jihua Du; Abdullah Demir; Peter Cheng; Jane Cheng; Hiroaki Ishiguro; Ruotao Li; Yuya Mizoguchi; Hiroshi Sako

doi:10.1117/12.2038268

7 March 2014 Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping

Erik Zucker, Daniel Zou, Laura Zavala, Hongbo Yu, Prasad Yalamanchili, Lei Xu, Hui Xu, David Venables, Jay Skidmore, Victor Rossin, Reddy Raju, Matthew Peters, Kai-Hsiu Liao, Kong-Weng Lee, Boris Kharlamov, Allen Hsieh, Rupa Gurram, James Guo, Nicolas Guerin, Jeff Gregg, Richard Duesterberg, Jihua Du, Abdullah Demir, Peter Cheng, Jane Cheng, Hiroaki Ishiguro, Ruotao Li, Yuya Mizoguchi, Hiroshi Sako

Author Affiliations +

Proceedings Volume 8965, High-Power Diode Laser Technology and Applications XII; 896507 (2014) https://doi.org/10.1117/12.2038268
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

A new 100μm aperture, 920nm laser diode chip was developed to improve fiber coupling efficiency and reliability. These chips have been assembled into single-emitter and multi-emitter packages with 105μm diameter fiber-coupled output. The single-emitter package is rated for 12W operation, while the multi-emitter package is rated at 140W. Power conversion efficiency is 50%. Over one year of accelerated active life testing has been completed along with a suite of passive, environmental qualification tests. These pumps have been integrated into 2kW, 4kW, and 6kW fiber laser engines that demonstrate excellent brightness, efficiency, and sheet metal cutting quality and speed.

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Erik Zucker, Daniel Zou, Laura Zavala, Hongbo Yu, Prasad Yalamanchili, Lei Xu, Hui Xu, David Venables, Jay Skidmore, Victor Rossin, Reddy Raju, Matthew Peters, Kai-Hsiu Liao, Kong-Weng Lee, Boris Kharlamov, Allen Hsieh, Rupa Gurram, James Guo, Nicolas Guerin, Jeff Gregg, Richard Duesterberg, Jihua Du, Abdullah Demir, Peter Cheng, Jane Cheng, Hiroaki Ishiguro, Ruotao Li, Yuya Mizoguchi, and Hiroshi Sako "Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping", Proc. SPIE 8965, High-Power Diode Laser Technology and Applications XII, 896507 (7 March 2014); https://doi.org/10.1117/12.2038268

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