Plasmonic modulator for three-dimensional chip-to-chip optical interconnects

Fanghui Ren; Xiangyu Wang; Alan X. Wang

doi:10.1117/12.2042431

8 March 2014 Plasmonic modulator for three-dimensional chip-to-chip optical interconnects

Fanghui Ren, Xiangyu Wang, Alan X. Wang

Proceedings Volume 8991, Optical Interconnects XIV; 89910V (2014) https://doi.org/10.1117/12.2042431
Event: SPIE OPTO, 2014, San Francisco, California, United States

Abstract

We present a surface-normal plasmonic modulator structure for three-dimensional (3-D) optical interconnects using subwavelength metallic photonic crystals. Optical transmission of the metallic slab was controlled by modulating the plasmonic bandgap of the metallic photonic crystal slab with a moderate index perturbation induced by thermo-optic effects. Our experimental results show that more than 60% modulation depth is achieved with only an index modulation of 0.0043.

Citation Download Citation

Fanghui Ren, Xiangyu Wang, and Alan X. Wang "Plasmonic modulator for three-dimensional chip-to-chip optical interconnects", Proc. SPIE 8991, Optical Interconnects XIV, 89910V (8 March 2014); https://doi.org/10.1117/12.2042431

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