Low temperature solder process to join a copper tube to a silicon wafer

Christo Versteeg; Marcio Scarpim de Souza

doi:10.1117/12.2066381

23 June 2014 Low temperature solder process to join a copper tube to a silicon wafer

Christo Versteeg, Marcio Scarpim de Souza

Proceedings Volume 9257, Sensors, MEMS and Electro-Optical Systems; 92570A (2014) https://doi.org/10.1117/12.2066381
Event: Third Conference on Sensors, MEMS and Electro-Optic Systems, 2014, Skukuza, Kruger National Park, South Africa

Abstract

With the application for wafer level packages, which could be Complementary Metal–Oxide–Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

Citation Download Citation

Christo Versteeg and Marcio Scarpim de Souza "Low temperature solder process to join a copper tube to a silicon wafer", Proc. SPIE 9257, Sensors, MEMS and Electro-Optical Systems, 92570A (23 June 2014); https://doi.org/10.1117/12.2066381

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