Material readiness for generation 2 directed self-assembly (DSA) < 24nm pitch

Eungnak Han; Todd R. Younkin; Manish Chandhok; Alan M. Myers; Tristan A. Tronic; Florian Gstrein; Kranthi Kumar Elineni; Ashish Gaikwad; Paul A. Nyhus; Praveen K. Setu; Charles H. Wallace

doi:10.1117/12.2086094

20 March 2015 Material readiness for generation 2 directed self-assembly (DSA) < 24nm pitch

Eungnak Han, Todd R. Younkin, Manish Chandhok, Alan M. Myers, Tristan A. Tronic, Florian Gstrein, Kranthi Kumar Elineni, Ashish Gaikwad, Paul A. Nyhus, Praveen K. Setu, Charles H. Wallace

Author Affiliations +

Proceedings Volume 9425, Advances in Patterning Materials and Processes XXXII; 94250O (2015) https://doi.org/10.1117/12.2086094
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

The self-assembling behavior of thermally annealed PS-b-PMMA block copolymer derivatives (GEN2 BCPs) was evaluated using a substrate modified by a random copolymer, commonly called a ‘brush’. Similar to PS-b-PMMA, surface modification using the random copolymer brush served as an effective technique for controlling the domain orientation of the GEN2 BCP and yielded aligned features with pitches below 24nm. Non-preferential and weakly preferential random copolymers were also defined and applied to DSA using a graphoepitaxial approach. Finally, a Dry Development Rinse Process (DDRP)^[1] was tested as a method to prevent pattern collapse and improve pattern transfer for GEN2 BCPs.

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Eungnak Han, Todd R. Younkin, Manish Chandhok, Alan M. Myers, Tristan A. Tronic, Florian Gstrein, Kranthi Kumar Elineni, Ashish Gaikwad, Paul A. Nyhus, Praveen K. Setu, and Charles H. Wallace "Material readiness for generation 2 directed self-assembly (DSA) < 24nm pitch", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250O (20 March 2015); https://doi.org/10.1117/12.2086094

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