Impact induced delamination detection and quantification with guided wavefield analysis

Zhenhua Tian; Cara A. C. Leckey; Lingyu Yu; Jeffrey P. Seebo

doi:10.1117/12.2083358

3 April 2015 Impact induced delamination detection and quantification with guided wavefield analysis

Zhenhua Tian, Cara A. C. Leckey, Lingyu Yu, Jeffrey P. Seebo

Proceedings Volume 9435, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2015; 94351P (2015) https://doi.org/10.1117/12.2083358
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2015, San Diego, California, United States

Abstract

This paper studies impact induced delamination detection and quantification methods via guided wavefield data and spatial wavenumber imaging. In this study, the complex geometry impact-like delamination damage in a composite laminate is created through the quasi-static indention technique. To detect and quantify the delamination damage, the guided ultrasonic waves are excited through a piezoelectric actuator, and the guided wavefields are measured by a scanning laser Doppler vibrometer. The acquired guided wavefields contain a wealth of information regarding the wave propagation in the composite plate and complex wave interaction at the delamination region. To process the wavefield data and evaluate the delamination damage, the measured wavefields are analyzed through the spatial wavenumber imaging method which can generate an image containing the dominant local wavenumber at each spatial location. For a proof of concept, the approach is first applied to a single Teflon insert simulating a delamination, and then to the complex geometry impact-like delamination damage. The results show that the spatial wavenumber imaging can not only determine the delamination location, but also provide quantitative information regarding the delamination size and shape. The detection results for the impact induced delamination are compared to an ultrasonic C-scan image and wavenumber images are studied for two different excitation frequencies. Fairly good agreement is observed for portions of the delamination, and differences in wavenumber are observed at the two different frequencies. Results demonstrate that the spatial wavenumber imaging is a promising technique for yielding delamination location and size information.

Citation Download Citation

Zhenhua Tian, Cara A. C. Leckey, Lingyu Yu, and Jeffrey P. Seebo "Impact induced delamination detection and quantification with guided wavefield analysis", Proc. SPIE 9435, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2015, 94351P (3 April 2015); https://doi.org/10.1117/12.2083358

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