Paper
23 September 2015 A miniaturized laser illumination module
A. T. Winzer, J. Freitag, P. Dannberg, M. Hintz, M. Schädel, V. Sandhya, H.-J. Freitag
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Abstract
We present a wafer-based technology for mass production of miniaturized laser units. Heart of the approach is a glass wafer, comprising a metal structure acting as electrical contact, optical aperture and mechanical carrier of up to several thousands of flipped surface emitting laser diodes on one side, and a polymer-on-glass micro optical array on the other side. Mounting and characterization methods performed on wafer level are presented. After separation the size of a single laser unit is as small as 640 x 700 x 1400 μm3 and achieves spot diameters below 1 mm at distance of 120 mm. Performance and excellent cost potential allows for application in optical micro sensors and consumer electronics.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. T. Winzer, J. Freitag, P. Dannberg, M. Hintz, M. Schädel, V. Sandhya, and H.-J. Freitag "A miniaturized laser illumination module", Proc. SPIE 9626, Optical Systems Design 2015: Optical Design and Engineering VI, 96261X (23 September 2015); https://doi.org/10.1117/12.2191318
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KEYWORDS
Vertical cavity surface emitting lasers

Semiconducting wafers

Glasses

Metals

Wafer-level optics

Manufacturing

Optical alignment

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