Paper
1 July 2015 Laser cutting metallic plates using a 2kW direct diode laser source
E. Fallahi Sichani, D. Hauschild, J. Meinschien, J. Powell, E. G. Assunção, J. Blackburn, A. H. Khan, C. Y. Kong
Author Affiliations +
Proceedings Volume 9657, Industrial Laser Applications Symposium (ILAS 2015); 96570C (2015) https://doi.org/10.1117/12.2179475
Event: Industrial Laser Applications Symposium 2015, 2015, Kenilworth, United Kingdom
Abstract
This paper investigates the feasibility of using a 2kW direct diode laser source for producing high-quality cuts in a variety of materials. Cutting trials were performed in a two-stage experimental procedure. The first phase of trials was based on a one-factor-at-a-time change of process parameters aimed at exploring the process window and finding a semi-optimum set of parameters for each material/thickness combination. In the second phase, a full factorial experimental matrix was performed for each material and thickness, as a result of which, the optimum cutting parameters were identified. Characteristic values of the optimum cuts were then measured as per BS EN ISO 9013:2002.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. Fallahi Sichani, D. Hauschild, J. Meinschien, J. Powell, E. G. Assunção, J. Blackburn, A. H. Khan, and C. Y. Kong "Laser cutting metallic plates using a 2kW direct diode laser source", Proc. SPIE 9657, Industrial Laser Applications Symposium (ILAS 2015), 96570C (1 July 2015); https://doi.org/10.1117/12.2179475
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KEYWORDS
Laser cutting

Aluminum

Semiconductor lasers

Oxygen

Copper

Nickel

Nitrogen

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