Paper
14 March 2016 Ultra-high amplified strain on 200 mm optical Germanium-On-Insulator (GeOI) substrates: towards CMOS compatible Ge lasers
V. Reboud, A. Gassenq, K. Guilloy, G. Osvaldo Dias, J. M. Escalante, S. Tardif, N. Pauc, J. M. Hartmann, J. Widiez, E. Gomez, E. Bellet Amalric, D. Fowler, D. Rouchon, I. Duchemin, Y. M. Niquet, F. Rieutord, J. Faist, R. Geiger, T. Zabel, E. Marin, H. Sigg, A. Chelnokov, V. Calvo
Author Affiliations +
Proceedings Volume 9752, Silicon Photonics XI; 97520F (2016) https://doi.org/10.1117/12.2212597
Event: SPIE OPTO, 2016, San Francisco, California, United States
Abstract
Currently, one of the main challenges in the field of silicon photonics is the fabrication of efficient laser sources compatible with the microelectronic fabrication technology. An alternative to the complexity of integration of group III-V laser compounds is advancing from high tensile strains applied to germanium leading to improved emission properties by transforming the material from an indirect to a direct bandgap semiconductor. Theory predicts this transformation occurs at around 4.7% uniaxial tensile strain or 2.0% bi-axial tensile strain. Here, we report on ultrahigh strains obtained by amplifying the residual strain from novel optical Germanium-On-Insulator (GeOI) substrates fabricated by Smart CutTM technology and patterned with micro-bridges and micro-crosses. The high crystalline quality of the GeOI layers dramatically declined the mechanical failure limits when liberating the Ge microbridges. Record level Raman shift of 8.1 cm-1 for biaxial (micro-crosses) and 8.7 cm-1 for uniaxial stress (micro-bridges) were reached by carefully designing the geometry of the micro-structures. The photoluminescence (PL) evolution is compared to theoretical calculations based on the tight-binding model revealing a detailed understanding of the influence of strain on the germanium optical properties.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
V. Reboud, A. Gassenq, K. Guilloy, G. Osvaldo Dias, J. M. Escalante, S. Tardif, N. Pauc, J. M. Hartmann, J. Widiez, E. Gomez, E. Bellet Amalric, D. Fowler, D. Rouchon, I. Duchemin, Y. M. Niquet, F. Rieutord, J. Faist, R. Geiger, T. Zabel, E. Marin, H. Sigg, A. Chelnokov, and V. Calvo "Ultra-high amplified strain on 200 mm optical Germanium-On-Insulator (GeOI) substrates: towards CMOS compatible Ge lasers", Proc. SPIE 9752, Silicon Photonics XI, 97520F (14 March 2016); https://doi.org/10.1117/12.2212597
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Cited by 17 scholarly publications and 3 patents.
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KEYWORDS
Germanium

Silicon

Raman spectroscopy

Semiconducting wafers

Ions

Crystals

Silicon photonics

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