Paper
25 March 2016 Chemical trimming overcoat: an enhancing composition and process for 193nm lithography
Cong Liu, Kevin Rowell, Lori Joesten, Paul Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, Charlotte Cutler, Gerd Pohlers, Wenyan Yin, Patricia Fallon, Mingqi Li, Hyun Jeon, Cheng Bai Xu, Pete Trefonas
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Abstract
As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cong Liu, Kevin Rowell, Lori Joesten, Paul Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, Charlotte Cutler, Gerd Pohlers, Wenyan Yin, Patricia Fallon, Mingqi Li, Hyun Jeon, Cheng Bai Xu, and Pete Trefonas "Chemical trimming overcoat: an enhancing composition and process for 193nm lithography", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97791Y (25 March 2016); https://doi.org/10.1117/12.2219688
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Cited by 1 scholarly publication.
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KEYWORDS
Photoresist materials

Photoresist developing

Semiconducting wafers

Cadmium

Critical dimension metrology

Line width roughness

Lithography

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