Paper
15 September 2016 Cliché fabrication method using precise roll printing process with 5 um pattern width
Yejin Shin, Inyoung Kim, Dong-Ho Oh, Taik-Min Lee
Author Affiliations +
Abstract
Among the printing processes for printed electronic devices, gravure offset and reverse offset method have drawn attention for its fine pattern printing possibility. These printing methods use cliché, which has critical effect on the final product precision and quality. In this research, a novel precise cliché replica method is proposed. It consists of copper sputtering, precise mask pattern printing with 5 um width using reverse offset printing, Ni electroplating, lift-off, etching, and DLC coating. We finally compare the fabricated replica cliché with the original one and print out precise patterns using the replica cliché.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yejin Shin, Inyoung Kim, Dong-Ho Oh, and Taik-Min Lee "Cliché fabrication method using precise roll printing process with 5 um pattern width", Proc. SPIE 9927, Nanoengineering: Fabrication, Properties, Optics, and Devices XIII, 99271M (15 September 2016); https://doi.org/10.1117/12.2235730
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KEYWORDS
Printing

Copper

Electroplating

Etching

Silver

Coating

Plating

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