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17 March 2023 Femtosecond GHz-burst laser processing for percussion drilling applications
Inka B. Manek-Hönninger, Pierre Balage, John Lopez, Guillaume Bonamis, Clemens Hönninger
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Proceedings Volume PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII; PC124080A (2023) https://doi.org/10.1117/12.2649827
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
Femtosecond GHz-burst mode laser processing has attracted much attention in the last few years. Very recently, we reported first results on percussion drilling and the process dynamics in this new regime. In this contribution, we present our latest results on top-down drilling in different dielectric materials. Holes of very high quality with a smooth and glossy inner surface and with aspect ratios up to 70 were obtained in fused silica. Moreover, we investigated the drilling depth and speed as a function of burst number and show a three-stage behavior in the drilling mechanism.
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Inka B. Manek-Hönninger, Pierre Balage, John Lopez, Guillaume Bonamis, and Clemens Hönninger "Femtosecond GHz-burst laser processing for percussion drilling applications", Proc. SPIE PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII, PC124080A (17 March 2023); https://doi.org/10.1117/12.2649827
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KEYWORDS
Femtosecond phenomena
Laser drilling
Laser processing
Amplifiers
Dielectrics
Laser sources
Materials processing
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