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22 November 2023 Sequence-defined polypeptoids as DUV and EUV chemically amplified resists
Cameron P. Adams, Xiangxi Meng, Florian H. Kaefer, Chenyun Yuan, Christopher K. Ober, Rachel A. Segalman
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Proceedings Volume PC12750, International Conference on Extreme Ultraviolet Lithography 2023; PC127500J (2023) https://doi.org/10.1117/12.2688477
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States
Abstract
As extreme ultraviolet lithography advances towards smaller feature sizes, controlling stochastics in resist materials is critical for maximizing performance. Most polymer photoresists have inherent chain-to-chain variations in molecular weight, composition, and sequence due to synthetic limitations. This, along with heterogeneities from the distribution of chemical additives, contributes to unacceptable levels of patterning defects. Polypeptoids are unique as a class of bio-inspired polymers that can be synthesized with perfectly defined sequence, composition, and molecular weight, yielding a uniform material. In this study, we present polypeptoid-based chemically amplified resists for EUVL and demonstrate the effects of sequence and functionality on patternability, as evaluated under DUV and electron-beam lithography.
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Cameron P. Adams, Xiangxi Meng, Florian H. Kaefer, Chenyun Yuan, Christopher K. Ober, and Rachel A. Segalman "Sequence-defined polypeptoids as DUV and EUV chemically amplified resists", Proc. SPIE PC12750, International Conference on Extreme Ultraviolet Lithography 2023, PC127500J (22 November 2023); https://doi.org/10.1117/12.2688477
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KEYWORDS
Chemically amplified resists
Deep ultraviolet
Extreme ultraviolet
Extreme ultraviolet lithography
Chemical composition
Optical lithography
Polymers
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