Poster
10 April 2024 Exploring the potential of EB lithography in EUV photomask manufacturing
Mei Ebisawa, Tsukasa Abe, Yukihiro Fujimura, Izumi Hotei, Masataka Yamaji, Yasutaka Morikawa, Tatsuya Tomita, Naoya Hayashi, Shingo Yoshikawa
Author Affiliations +
Conference Poster
Abstract
EUV Lithography is an important technology that drives semiconductor device miniaturization. It is currently undergoing high volume manufacturing (HVM) of 3 nm logic node and development of 2 nm node by leading-edge semiconductor manufacturers. EUV mask technology is becoming increasingly important factor for EUV lithography. Mask resolution requirement is under 25nm for 2nm node Technology node. DNP has developed the EUV mask process with using the low-sensitivity-high-resolution resist and multi beam mask writer (MBMW) and This process shows promising capability on the resolution for 2nm Logic technology. For A14 Technology need more high resolution mask, In this paper, we present a comprehensive study on mask processes that possess a resolution of 20nm or below and techniques aimed at enhancing lithography contrast.
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mei Ebisawa, Tsukasa Abe, Yukihiro Fujimura, Izumi Hotei, Masataka Yamaji, Yasutaka Morikawa, Tatsuya Tomita, Naoya Hayashi, and Shingo Yoshikawa "Exploring the potential of EB lithography in EUV photomask manufacturing", Proc. SPIE PC12953, Optical and EUV Nanolithography XXXVII, PC1295313 (10 April 2024); https://doi.org/10.1117/12.3013224
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KEYWORDS
Extreme ultraviolet

Lithography

Manufacturing

Photomasks

Photoresist processing

Extreme ultraviolet lithography

High volume manufacturing

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