Deep x-ray lithography for micromechanics

Todd R. Christenson; Henry Guckel

doi:10.1117/12.221271

19 September 1995 Deep x-ray lithography for micromechanics

Todd R. Christenson, Henry Guckel

Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221271
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

Extensions of the German LIGA process have brought about fabrication capability suitable for cost effective production of precision engineered components. The process attributes a low fabrication of mechanical components which are not capable of being made via conventional subtractive machining methods. Two process improvements have been responsible for this extended capability which involve the areas of thick photoresist application and planarization via precision lapping. Application of low-stress x-ray photoresist has been achieved using room temperature solvent bonding of a preformed photoresist sheet. Precision diamond lapping and polishing has provided a flexible process for the planarization of a wide variety of electroplated metals in the presence of photoresist. Exposure results from the 2.5 GeV National Synchrotron Light Source storage ring at Brooklyn National Laboratory have shown that structural heights of several millimeter and above are possible. The process capabilites are also well suited for microactuator fabrication. Linear and rotational magnetic microactuator have been constructed which use coil winding technology with LIGA fabricated coil forms. Actuator output forces of 1 milliNewton have been obtained with power dissipation on the order of milliWatts. A rotational microdynamometer system which is capable of measuring torque-speed data is also discussed.

Citation Download Citation

Todd R. Christenson and Henry Guckel "Deep x-ray lithography for micromechanics", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221271

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