Ductile regime grinding or shear-mode grinding is an enabling technology that is finding application in the optics manufacturing industry. By definition, ductile removal occurs when the scale of machining is conducted below a material-dependent critical dimension or chip size. Much of the interest in ductile grinding resides in manufacturing glass optics, which experience brittle-ductile transition at on the order of magnitude 10 nm. Silicon carbide has a critical dimension that is on the order of 100 - 200 nm, making it a more attractive candidate for the technology. Preliminary results from an on-axis chemical vapor deposited (CVD) SiC sphere (f/14) indicate 317 angstrom surface roughness and 0.96 wave P-V figure were achieved with this manufacturing method. Surface finish, interferometric measured figure and BRDF scatter results are presented from ductile regime grinding of 40 and 75 mm flats of CVD silicon carbide, bare reaction bonded SiC (RBSiC) and uniaxial hot-pressed SiC (HPSiC).© (1994) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.