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Proceedings Article

Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure

[+] Author Affiliations
Howard Fein

Pressco Technology Inc. (USA)

Proc. SPIE 1999, Adhesives Engineering, 248 (September 27, 1993); doi:10.1117/12.158612
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From Conference Volume 1999

  • Adhesives Engineering
  • Eric A. Norland; Kenneth M. Liechti
  • San Diego, CA | July 11, 1993

abstract

Holographic Interferometry techniques have been successfully employed to characterize and test the behavior of structures under stress. These techniques are especially suited to investigating the efficacy of bonds at the interfaces of different materials in complex laminated structures. Complex bonded structures of highly dissimilar materials are often difficult to characterize with radiographic, ultrasonic, or other 'conventional' techniques. Such structures can present great variations in density and extremes in bond strength, as well as tremendous dimensional differences which may foil such non-destructive evaluation. These are ideal requisites, however, for analysis using advanced real-time and multi-exposure holographic methods.

© (1993) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Howard Fein
"Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure", Proc. SPIE 1999, Adhesives Engineering, 248 (September 27, 1993); doi:10.1117/12.158612; http://dx.doi.org/10.1117/12.158612


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