Glass wafer direct bonding: a new technology for monomode optical integrated devices

Serge Pelissier; Gregory Pandraud; Florent Pigeon; Alain Mure-Ravaud; Jean-Pierre Meunier; B. Biasse

doi:10.1117/12.248512

26 August 1996 Glass wafer direct bonding: a new technology for monomode optical integrated devices

Serge Pelissier, Gregory Pandraud, Florent Pigeon, Alain Mure-Ravaud, Jean-Pierre Meunier, B. Biasse

Proceedings Volume 2783, Micro-Optical Technologies for Measurement, Sensors, and Microsystems; (1996) https://doi.org/10.1117/12.248512
Event: Lasers, Optics, and Vision for Productivity in Manufacturing I, 1996, Besancon, France

Abstract

We propose a new fabrication method for monomode optical integrated devices. As an example, we show how a deeply buried planar waveguide can be obtained by assembling two half waveguides. These ones are realized by ion exchange and the assembling method is the wafer direct bonding (WDB). The optical properties are studied and compared with theory. The results prove that direct bonding, as in VLSI batch technology, is a low cost and high performance technology for optical devices fabrication.

Citation Download Citation

Serge Pelissier, Gregory Pandraud, Florent Pigeon, Alain Mure-Ravaud, Jean-Pierre Meunier, and B. Biasse "Glass wafer direct bonding: a new technology for monomode optical integrated devices", Proc. SPIE 2783, Micro-Optical Technologies for Measurement, Sensors, and Microsystems, (26 August 1996); https://doi.org/10.1117/12.248512

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