A new and effective 3D measurement system for micro solder bump

Heui Jae Pahk; Zhu Cheng Li; Jeong-Il Mun

doi:10.1117/12.905072

15 November 2011 A new and effective 3D measurement system for micro solder bump

Heui Jae Pahk, Zhu Cheng Li, Jeong-Il Mun

Proceedings Volume 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation; 83212J (2011) https://doi.org/10.1117/12.905072
Event: Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 2011, Yunnan, China

Abstract

Fringe projection with phase shifting technology has been widely used for micro solder bump inspection. Spherical solder bump is referred to as specular-dominant, mirror-like, metallic reflection. Specifically, the saturated area is placed on the top of the bump surface, it makes the height profile distort and could not interpret reliable height data. In this paper, we propose a new three-dimensional measurement system with circular motion that can easily evaluate relationship between projection angle and reflectance of the bump, tackling these issues. The proposed system without any additional polarizer and cameras, makes saturated pixels far away from the center of the solder surface so that most saturated pixels are placed on the out of the measuring target area by increasing projection angle. The accurate height profile and high repeatability are obtained as reliable measurement results with the optimal projection angle, and it shows high potential for practical micro bump inspection in field.

Citation Download Citation

Heui Jae Pahk, Zhu Cheng Li, and Jeong-Il Mun "A new and effective 3D measurement system for micro solder bump", Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83212J (15 November 2011); https://doi.org/10.1117/12.905072

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