Paper
8 February 2012 Hard solder 20-kW QCW stack array diode laser
Author Affiliations +
Abstract
With the increasing applications of high power semiconductor lasers in industry, advanced manufacturing, aerospace, medical systems, display, entertainment, etc., semiconductor lasers with high power and high performances are required. The performance of semiconductor lasers is greatly affected by packaging structure, packaging process and beam shaping. A novel macro channel cooler (MaCC) for stack array laser with good heat dissipation capacity and high reliability is presented in this work. Based on the MaCC package, a high power stack array diode laser is successfully fabricated. A series of techniques such as spectrum control and beam control are used to achieve narrow spectrum and high beam quality. The performances of the semiconductor laser stack array are characterized. A high power 20kW QCW hard solder packaged stack array laser is fabricated; a narrow spectrum of 3.94 nm and an excellent rectangular beam shape are obtained. The lifetime of the stack array laser is tested as well.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaoning Li, Lijun Kang, Jingwei Wang, Pu Zhang, Lingling Xiong, and Xingsheng Liu "Hard solder 20-kW QCW stack array diode laser", Proc. SPIE 8241, High-Power Diode Laser Technology and Applications X, 82410C (8 February 2012); https://doi.org/10.1117/12.909772
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CITATIONS
Cited by 1 scholarly publication and 2 patents.
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KEYWORDS
Semiconductor lasers

High power lasers

Beam controllers

Reliability

Packaging

Beam shaping

Collimation

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