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Proceedings Article

Novel hierarchically dimensioned deformable mirrors with integrated ASIC driver electronics

[+] Author Affiliations
Xingtao Wu, Li Yao, Haijiang Ou

Microscale, Inc. (USA)

Proc. SPIE 8253, MEMS Adaptive Optics VI, 82530A (February 9, 2012); doi:10.1117/12.908507
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From Conference Volume 8253

  • MEMS Adaptive Optics VI
  • Scot S. Olivier; Thomas G. Bifano; Joel Kubby
  • San Francisco, California, USA | January 21, 2012

abstract

We report on an effort of building a new form of deformable mirror (DM) driven by an array of giant piezo microactuators and being integrated with an ASIC driver electronics. The actuator layer is obtained by bonding a thin Si wafer with a thin PMN-PT crystal substrate, and is in attachment with a bulk-micromachined mirror hierarchy comprising of a supporting Si layer as the spacer, a Si post layer as the motion sampler, and atop of which a Si micromembrane layer as the deformable mirror. The ASIC employs a charge controlled approach to actuate the large capacitance (~nF) in associating with the high-energy-density actuators, capable of charging/discharging an array from quasi-static to 20 kHz framing rate, and with ultra-low-power dissipation that approximates the theoretical minimum of a driver electronics. The DM to ASIC integration is currently accomplished at chip level. An integrated DM prototype has 32x32 actuator elements at 600um pitch, weighing ~50 grams, as compact as ~1 cubic inch, and uses 25 wires to access the 1024 actuators. Fundamental characterizations of a few ASIC drivers are also presented.

© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

Xingtao Wu ; Li Yao and Haijiang Ou
"Novel hierarchically dimensioned deformable mirrors with integrated ASIC driver electronics", Proc. SPIE 8253, MEMS Adaptive Optics VI, 82530A (February 9, 2012); doi:10.1117/12.908507; http://dx.doi.org/10.1117/12.908507


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