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Proceedings Article

Photonic integrated circuits based on novel glass waveguides and devices

[+] Author Affiliations
Yaping Zhang, Deng Zhang, Weijian Pan, Helen Rowe, Trevor Benson, Armando Loni, Phillip Sewell, David Furniss, Angela B. Seddon

The Univ. of Nottingham (United Kingdom)

Proc. SPIE 6183, Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits, 61830A (April 20, 2006); doi:10.1117/12.660781
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From Conference Volume 6183

  • Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits
  • Giancarlo C. Righini
  • Strasbourg, France | April 03, 2006

abstract

Novel materials, micro-, nano-scale photonic devices, and 'photonic systems on a chip' have become important focuses for global photonics research and development. This interest is driven by the rapidly growing demand for broader bandwidth in optical communication networks, and higher connection density in the interconnection area, as well as a wider range of application areas in, for example, health care, environment monitoring and security. Taken together, chalcogenide, heavy metal fluoride and fluorotellurite glasses offer transmission from ultraviolet to mid-infrared, high optical non-linearity and the ability to include active dopants, offering the potential for developing optical components with a wide range of functionality. Moreover, using single-mode large cross-section glass-based waveguides as an optical integration platform is an elegant solution for the monolithic integration of optical components, in which the glass-based structures act both as waveguides and as an optical bench for integration. We have previously developed a array of techniques for making photonic integrated circuits and devices based on novel glasses. One is fibre-on-glass (FOG), in which the fibres can be doped with different active dopants and pressed onto a glass substrate with a different composition using low-temperature thermal bonding under mechanical compression. Another is hot-embossing, in which a silicon mould is placed on top of a glass sample, and hot-embossing is carried out by applying heat and pressure. In this paper the development of a fabrication technique that combines the FOG and hot-embossing procedures to good advantage is described. Simulation and experimental results are presented.

© (2006) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Yaping Zhang ; Deng Zhang ; Weijian Pan ; Helen Rowe ; Trevor Benson, et al.
"Photonic integrated circuits based on novel glass waveguides and devices", Proc. SPIE 6183, Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits, 61830A (April 20, 2006); doi:10.1117/12.660781; http://dx.doi.org/10.1117/12.660781


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