An analysis of ultrashort pulse laser micromachining parameters for the optimization of shallow hole drilling

Benjamin R. Campbell; Vladimir V. Semak; Jeffrey G. Thomas

doi:10.1117/12.669402

7 June 2006 An analysis of ultrashort pulse laser micromachining parameters for the optimization of shallow hole drilling

Benjamin R. Campbell, Vladimir V. Semak, Jeffrey G. Thomas

Author Affiliations +

Proceedings Volume 6261, High-Power Laser Ablation VI; 62612D (2006) https://doi.org/10.1117/12.669402
Event: High-Power Laser Ablation 2006, 2006, Taos, NM, United States

Abstract

Using a factorial design of experiments approach with ANOVA, laser drilling experiments were performed on the semiconductor mercury-cadmium-telluride (HgCdTe). A commercial CPA femtosecond laser system operating at 775nm was used for the experiments. The test variables include laser parameters such as pulse length, fluence, beam shaping using apertures, assist gas, vacuum, and others. The response variable examined for optimization include hole size, hole depth, and melt effects. The analysis yielded an empirical formula for predicting laser drilling effects.

Citation Download Citation

Benjamin R. Campbell, Vladimir V. Semak, and Jeffrey G. Thomas "An analysis of ultrashort pulse laser micromachining parameters for the optimization of shallow hole drilling", Proc. SPIE 6261, High-Power Laser Ablation VI, 62612D (7 June 2006); https://doi.org/10.1117/12.669402

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