High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

Wojciech J. Walecki; Alexander Pravdivtsev; Manuel Santos II; Ann Koo

doi:10.1117/12.675592

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High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

Wojciech J. Walecki ; Alexander Pravdivtsev ; Manuel Santos II ; Ann Koo

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Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos II, Ann Koo

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Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (August 14, 2006); doi:10.1117/12.675592

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From Conference Volume 6293

Interferometry XIII: Applications
Erik L. Novak; Wolfgang Osten; Christophe Gorecki
San Diego, CA | August 13, 2006

Abstract

abstract

We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.

Citation

Wojciech J. Walecki ; Alexander Pravdivtsev ; Manuel Santos II and Ann Koo
"High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring", Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (August 14, 2006); doi:10.1117/12.675592; http://dx.doi.org/10.1117/12.675592

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Wojciech J. Walecki ; Alexander Pravdivtsev ; Manuel Santos II ; Ann Koo; High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring. Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (August 14, 2006); doi:10.1117/12.675592.

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High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

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