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Proceedings Article

High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

[+] Author Affiliations
Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos II, Ann Koo

Frontier Semiconductor

Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (August 14, 2006); doi:10.1117/12.675592
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From Conference Volume 6293

  • Interferometry XIII: Applications
  • San Diego, California, USA | August 13, 2006

abstract

We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.

© (2006) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Wojciech J. Walecki ; Alexander Pravdivtsev ; Manuel Santos II and Ann Koo
"High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring", Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (August 14, 2006); doi:10.1117/12.675592; http://dx.doi.org/10.1117/12.675592


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