Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

El-Hang Lee; S. G. Lee; B. H. O; S. G. Park; H. S. Noh; K. H. Kim; S. H. Song

doi:10.1117/12.708003

8 September 2006 Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

El-Hang Lee, S. G. Lee, B. H. O, S. G. Park, H. S. Noh, K. H. Kim, S. H. Song

Author Affiliations +

Proceedings Volume 6343, Photonics North 2006; 63433E (2006) https://doi.org/10.1117/12.708003
Event: Photonics North 2006, 2006, Quebec City, Canada

Abstract

A collective overview and review is presented on the original work conducted on the theory, design, fabrication, and in-tegration of micro/nano-scale optical wires and photonic devices for applications in a newly-conceived photonic systems called "optical printed circuit board" (O-PCBs) and "VLSI photonic integrated circuits" (VLSI-PIC). These are aimed for compact, high-speed, multi-functional, intelligent, light-weight, low-energy and environmentally friendly, low-cost, and high-volume applications to complement or surpass the capabilities of electrical PCBs (E-PCBs) and/or VLSI electronic integrated circuit (VLSI-IC) systems. These consist of 2-dimensional or 3-dimensional planar arrays of micro/nano-optical wires and circuits to perform the functions of all-optical sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards or substrates. The integrated optical devices include micro/nano-scale waveguides, lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices, made of polymer, silicon and other semiconductor materials. For VLSI photonic integration, photonic crystals and plasmonic structures have been used. Scientific and technological issues concerning the processes of miniaturization, interconnection and integration of these systems as applicable to board-to-board, chip-to-chip, and intra-chip integration, are discussed along with applications for future computers, telecommunications, and sensor-systems. Visions and challenges toward these goals are also discussed.

Citation Download Citation

El-Hang Lee, S. G. Lee, B. H. O, S. G. Park, H. S. Noh, K. H. Kim, and S. H. Song "Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses", Proc. SPIE 6343, Photonics North 2006, 63433E (8 September 2006); https://doi.org/10.1117/12.708003

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Waveguides

Very large scale integration

Photonic crystals

Integrated optics

Photonic integrated circuits

Photonic devices

Refractive index

Show All Keywords

Keywords/Phrases

Search In:

Publication Years