Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

An ultra-uniform ultra-thin resist deposition process

[+] Author Affiliations
Gilles Picard, Juan Schneider

Nanometrix Inc. (Canada)

Brian J. Grenon

Grenon Consulting, Inc.

Proc. SPIE 6349, Photomask Technology 2006, 634907 (October 20, 2006); doi:10.1117/12.685640
Text Size: A A A
From Conference Volume 6349

  • Photomask Technology 2006
  • Patrick M. Martin; Robert J. Naber
  • Monterey, CA | September 18, 2006


An ultra-uniform, ultra-thin resist deposition process is presented. Nanometrix applications development with Ultra Thin Polymer Films (UTPF) production process addresses several problems related to resist deposition for lithographic applications. The linear coating process based on the Schneider-Picard (SP) method is a driven assembly process. Linear meter per minute coating rates are produced while providing an outstanding film quality at nano- to micro scale thinness. Therefore, this coating method provides a viable alternative for resist application. Our present developments on nano and micro ultra-thin polymer film coatings give substantial new solutions for improved, faster and less expensive coating production. Materials, writing and quality control costs may be substantially reduced with UTPF deposition technology. Results from three resists are presented in this paper. E-beam direct writing on 8 nm PMMA and photolithography on ILine and DUV resists in the scale of 30 nm are presented. Thicker resist deposition has been performed as well in the range of 1-10 microns thick. Film edge bead in the order of film thickness are obtained (1000 x smaller than spin coating process). Substrates were all coated with uniform ultra-thin films at a rate of one square meter per minute with atomic smoothness. This technological breakthrough enables a valuable solution for resist deposition and lithography fabrication at the nano and micro scales and provides resist uniformity required for current and future critical dimension specifications.

© (2006) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Gilles Picard ; Juan Schneider and Brian J. Grenon
"An ultra-uniform ultra-thin resist deposition process", Proc. SPIE 6349, Photomask Technology 2006, 634907 (October 20, 2006); doi:10.1117/12.685640; http://dx.doi.org/10.1117/12.685640

Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).



Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.