Tin inventory for HVM EUVL sources

Martin C. Richardson; Kazutoshi Takenoshita; Tobias Schmid

doi:10.1117/12.713463

15 March 2007 Tin inventory for HVM EUVL sources

Martin C. Richardson, Kazutoshi Takenoshita, Tobias Schmid

Proceedings Volume 6517, Emerging Lithographic Technologies XI; 65170S (2007) https://doi.org/10.1117/12.713463
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Tin is one of the most efficient source materials for both gas discharge plasma sources and laser produced plasma sources for EUV lithography. Unlike Xenon which was the material commonly investigated for the EUVL source application, recycling of the target materials is not necessary for tin targets because of its low relative cost. However, in assessing the benefits of different source architectures, there are large differences in the size of the tin inventory used, and consequences that ensue. In this paper we make a first attempt to compare these differences, and assess their impact. Utilizing tin as the radiator at 13.5 nm reduces the total cost of the source system significantly.

Citation Download Citation

Martin C. Richardson, Kazutoshi Takenoshita, and Tobias Schmid "Tin inventory for HVM EUVL sources", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170S (15 March 2007); https://doi.org/10.1117/12.713463

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