Investigation of mechanical and conductive properties of shape memory polymer composite (SMPC)

Jinsong Leng; Xin Lan; Haibao Lv; Dawei Zhang; Yanju Liu; Shanyi Du

doi:10.1117/12.715510

20 April 2007 Investigation of mechanical and conductive properties of shape memory polymer composite (SMPC)

Jinsong Leng, Xin Lan, Haibao Lv, Dawei Zhang, Yanju Liu, Shanyi Du

Proceedings Volume 6526, Behavior and Mechanics of Multifunctional and Composite Materials 2007; 65262V (2007) https://doi.org/10.1117/12.715510
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2007, San Diego, California, United States

Abstract

This paper is concerned about an investigation of mechanical and electrical conductive properties of carbon fiber fabric reinforced shape memory polymer composite (SMPC). The shape memory polymer (SMP) is a thermoset styrene-based resin. SMP is a promising smart material, which is under intensive investigation at present. Its primary advantages over other smart materials are the high strain capacity (200% reversible strain), low density and low cost etc.. But its major drawbacks are low strength, low modulus and low recovery stress. So the fiber reinforced SMPC was naturally considered to be investigated in this paper, which may overcome the disadvantages mentioned above. The investigation was conducted with experimental methods: Dynamic Mechanical Analyzer (DMA), static and mechanical cycle loading tests, microscope observation of microstructural deformation mechanism, conductivity and shape recovery tests. Results indicated that SMPC showed higher glass transition temperature (T_g) than neat SMP and improved the storage modulus, bending modulus, strength and resistance against relaxation and creep. Both fiber microbuckling and fracture of SMPC were observed after the static 3-ponit bending test at the constant room temperature. SMPC showed favorable recovery performances during thermomechanical cycles of the bending recovery test and the fiber microbuckling was obvious. Moreover, the conductive SMPC of this study experienced low electrical resistivity and performed a good shape memory effect during numerous thermomechanical cycles.

Citation Download Citation

Jinsong Leng, Xin Lan, Haibao Lv, Dawei Zhang, Yanju Liu, and Shanyi Du "Investigation of mechanical and conductive properties of shape memory polymer composite (SMPC)", Proc. SPIE 6526, Behavior and Mechanics of Multifunctional and Composite Materials 2007, 65262V (20 April 2007); https://doi.org/10.1117/12.715510

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