Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining

[+] Author Affiliations
Gleb V. Vdovin

Technische Univ. Delft (Netherlands) and OKO Technologies (Netherlands)

Ourang Akhzar-Mehr, Pasqualina M. Sarro, Davies W. De Lima Monteiro, Mikhail Y. Loktev

Technische Univ. Delft (Netherlands)

Proc. SPIE 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly, 107 (March 24, 2003); doi:10.1117/12.471992
Text Size: A A A
From Conference Volume 4945

  • MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
  • Uwe F. W. Behringer; Bernard Courtois; Ali M. Khounsary; Deepak G. Uttamchandani
  • Brugge, Belgium | October 28, 2002

abstract

We have extended the technology of fabrication of optical spherical mirrors by using single-mask bulk micromachining to fabricate highly-uniform spherical arrays of micro-mirrors and to mold polymer-on-glass microlenses. The arrays fabricated feature 100% optical fill factor and very high field uniformity of optical characteristics of individual micro-mirrors (lenses). The technology is specially suitable for the fabrication of uniform arrays of spherical mirrors with small numerical apertures for use in Hartmann-Shack wavefront sensors. Optical tests with the hexagonal array of molded microlenses with pitch of 300μm and focal length of ~30mm demonstrated that the contribution of microlens imperfections into the wavefront reconstruction error does not exceed λ/50 rms .

© (2003) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Gleb V. Vdovin ; Ourang Akhzar-Mehr ; Pasqualina M. Sarro ; Davies W. De Lima Monteiro and Mikhail Y. Loktev
"Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining", Proc. SPIE 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly, 107 (March 24, 2003); doi:10.1117/12.471992; http://dx.doi.org/10.1117/12.471992


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement


  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.