Paper
19 June 2003 Ultrashort laser pulse processing of wave guides for medical applications
Author Affiliations +
Abstract
The availability of ultra short (ps and sub-ps) pulsed lasers has stimulated a growing interest in exploiting the enhanced flexibility of femtosecond and/or picosecond laser technology for micro-machining. The high peak powers available at relatively low single pulse energies potentially allow for a precise localization of photon energy, either on the surface or inside (transparent) materials. Three dimensional micro structuring of bulk transparent media without any sign of mechanical cracking has been demonstrated. In this study, the potential of ultra short laser processing was used to modify the cladding-core interface in normal fused silica wave guides. The idea behind this technique is to enforce a local mismatch for total reflection at the interface at minimal mechanic stress. The laser-induced modifications were studied in dependence of pulse width, focal alignment, single pulse energy and pulse overlap. Micro traces with a thickness between 3 and 8 μm were generated with a spacing of 10 μm in the sub-surface region using sub-ps and ps laser pulses at a wavelength of 800 nm. The optical leakage enforced by a micro spiral pattern is significant and can be utilized for medical applications or potentially also for telecommunications and fiber laser technology.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Ashkenasi, Arkadi Rosenfeld, Stefan B. Spaniol, and Albert Terenji "Ultrashort laser pulse processing of wave guides for medical applications", Proc. SPIE 4978, Commercial and Biomedical Applications of Ultrafast Lasers III, (19 June 2003); https://doi.org/10.1117/12.478583
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Cited by 7 scholarly publications.
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KEYWORDS
Waveguides

Picosecond phenomena

Interfaces

Laser processing

Pulsed laser operation

Laser applications

Image processing

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