Paper
8 May 2012 Low f-number microlens array fabricated in thick resist
Giuseppe A. Cirino, Arlindo N. Montagnoli, Patrick Verdonck, Luiz G. Neto
Author Affiliations +
Abstract
In certain applications of MOEMS devices, it is often necessary to produce microlens array structures that concentrate optical power in semiconductor photodetectors. In this work, the design and fabrication of a low f-number cylindrical microlens array is presented. The lenses were fabricated in thick photo resist - 12 μm thick - using a contact printer exposure through a mask with a repetitive 6 μm line - 4 μm space pattern. The width of the resulting microlens array was determined to be 10 μm, with f-number of 0.5. Numerical calculations based on scalar diffraction theory were employed to model the light propagation inside the resist, determining the aerial image as a function of its thickness. Than the resist response characteristics, expressed by its contrast curve, and absorption rate were used to obtain a cross section profile. A good match between numerical and experimental results were found.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Giuseppe A. Cirino, Arlindo N. Montagnoli, Patrick Verdonck, and Luiz G. Neto "Low f-number microlens array fabricated in thick resist", Proc. SPIE 8428, Micro-Optics 2012, 842819 (8 May 2012); https://doi.org/10.1117/12.914417
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KEYWORDS
Photomasks

Microlens array

Diffraction

Photoresist processing

Transmittance

Printing

Absorption

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