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Proceedings Article

Tapered fused bundle coupler package for reliable high optical power dissipation

[+] Author Affiliations
François Séguin, Alexandre Wetter, Lilian Martineau, Mathieu Faucher, Claude Delisle, Stéphane Caplette

ITF Optical Technologies (Canada)

Proc. SPIE 6102, Fiber Lasers III: Technology, Systems, and Applications, 61021N (February 23, 2006); doi:10.1117/12.661254
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From Conference Volume 6102

  • Fiber Lasers III: Technology, Systems, and Applications
  • Andrew J. W. Brown; Johan Nilsson; Donald J. Harter; Andreas Tünnermann
  • San Jose, CA | January 21, 2006

abstract

Light absorption in structural adhesives constitutes the main source of heat in tapered fused bundle (TFB) devices. Efficient heat dissipation solutions were developed by studying these thermal loads. The relative merits of transparent vs. opaque package designs were established experimentally. In the former, light escapes without being absorbed by the package walls, whereas in the latter, the spurious optical signal is directly absorbed and dissipated. The fact that heat is generated directly in the adhesive largely favors the opaque package, which offers more efficient heat extraction. By using a thermally conductive package, a temperature rise of 1.1°C per Watt of dissipated power was measured. These numbers demonstrate that passive heat sinking at 20°C is sufficient to allow reliable operation up to 45Watts of dissipated power (1kW with 0.2dB optical loss) without compromising long-term reliability.

© (2006) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

François Séguin ; Alexandre Wetter ; Lilian Martineau ; Mathieu Faucher ; Claude Delisle, et al.
"Tapered fused bundle coupler package for reliable high optical power dissipation", Proc. SPIE 6102, Fiber Lasers III: Technology, Systems, and Applications, 61021N (February 23, 2006); doi:10.1117/12.661254; http://dx.doi.org/10.1117/12.661254


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