Light absorption in structural adhesives constitutes the main source of heat in tapered fused bundle (TFB) devices.
Efficient heat dissipation solutions were developed by studying these thermal loads. The relative merits of transparent
vs. opaque package designs were established experimentally. In the former, light escapes without being absorbed by the
package walls, whereas in the latter, the spurious optical signal is directly absorbed and dissipated. The fact that heat is
generated directly in the adhesive largely favors the opaque package, which offers more efficient heat extraction. By
using a thermally conductive package, a temperature rise of 1.1°C per Watt of dissipated power was measured. These
numbers demonstrate that passive heat sinking at 20°C is sufficient to allow reliable operation up to 45Watts of
dissipated power (1kW with 0.2dB optical loss) without compromising long-term reliability.© (2006) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.