Integration issues of a photonic layer on top of a CMOS circuit

J. M. Fedeli; R. Orobtchouk; C. Seassal; L. Vivien

doi:10.1117/12.642672

1 March 2006 Integration issues of a photonic layer on top of a CMOS circuit

J. M. Fedeli, R. Orobtchouk, C. Seassal, L. Vivien

Proceedings Volume 6125, Silicon Photonics; 61250H (2006) https://doi.org/10.1117/12.642672
Event: Integrated Optoelectronic Devices 2006, 2006, San Jose, California, United States

Abstract

Photonics on CMOS is the integration of CMOS technology and optics components to enable either improved functionality of the electronic circuit (e.g. optical clock distribution) or as a means to miniaturize optical functions (e.g. miniaturised transceiver). The Near Infra Red (NIR) wavelength range (1.3 or 1.55μm) was chosen for this to minimise the impact the light on the behaviour of the microelectronic components. The integration of a photonic layer on a CMOS circuit can be seen in different ways: A combined fabrication at the front end level, the wafer bonding of an SOI photonic circuit at the back-end level, or the insertion of an embedded photonic layer between metallization schemes. For combined fabrication, a silicon on insulator rib technology has been developed with low (0.4dB/cm) propagation loss, ultra-high speed Ge-on-Si photodetector and SiGe/Si modulators.. In the metal-semiconductor-metal (MSM) configuration, bandwith of 35 GHz at 1.3 μm and 1.55μm has been measured. In the second approach, a wafer bonding of silicon rib and stripe technologies was achieved above the metallization layers of a CMOS wafer. For the third method, direct fabrication of a photonic layer at the back-end level was achieved using low temperature processes. Waveguide technologies such as SiNx (loss 2dB/cm) or amorphous silicon (loss 5dB/cm) were developed and were followed by the molecular bonding of InP die, these were needed to create the optoelectronic components (sources and detectors). Using an InP microdisk, 50% coupling was achieved to a stripe silicon waveguide.

Citation Download Citation

J. M. Fedeli, R. Orobtchouk, C. Seassal, and L. Vivien "Integration issues of a photonic layer on top of a CMOS circuit", Proc. SPIE 6125, Silicon Photonics, 61250H (1 March 2006); https://doi.org/10.1117/12.642672

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available