Paper
14 September 2007 A dual channel lens for simultaneous VIS and SWIR imaging in harsh radiation environments
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Abstract
Rapid thermal annealing that utilizes broadband flash lamp sources requires optical diagnostics for instantaneous thermal mapping of silicon wafers and its in-situ monitoring during the process. A new split channel optical assembly offering simultaneous imaging via CMOS- and FPA-imager was designed. Reverse telephoto optical design allows distortion of <2.5% in both imaging paths over the field of view of ±18° with deep field range and no instrument protrusion into the semiconductor process chamber. Application of solarization resistant materials in a first negative group as well as a rugged housing suits the design to optically harsh environments. Additional stray light measures were taken to control heat dissipation inside the narrow lens barrel by the arrangement of refractive surfaces and absorptive baffles. The beam splitter in front of a second positive group is made of silicon, which both provides preliminary spectral filtering in the near infrared through-channel and further extends spectral capabilities of the visible (reflected) channel into UV-B region. Detailed lens performance, manufacturing aspects and other use of the lens - for direct discrimination of water-containing objects from the image pattern are reviewed.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sergiy Dets "A dual channel lens for simultaneous VIS and SWIR imaging in harsh radiation environments", Proc. SPIE 6668, Novel Optical Systems Design and Optimization X, 66680L (14 September 2007); https://doi.org/10.1117/12.734766
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KEYWORDS
Silicon

Short wave infrared radiation

Semiconducting wafers

Beam splitters

Lamps

Cameras

Optical design

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