Paper
30 December 2003 Three-dimensional photolithography based on image reversal
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Abstract
In this paper we present a novel fabrication method for the realization of complex 3D multi-layer structures with commercially available photoresists. This method is based on the observation that during an image-reversal process, the post exposure bake (PEB) that is used to reverse the contrast of the exposed pattern reduces the sensitivity of the unexposed photoresist at the same time. In multi-layer lithography, this phenomenon, along with non-uniformly distributed dose can be exploited to eliminate the re-patterning effect of the subsequent exposures and thus makes suspended 3D structures possible. In this presentation we demonstrate this observation experimentally, and fabricate “woodpile” structures (≥ 3 layers) using the proposed method.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peng Yao, Garrett Schneider, Binglin Miao, Janusz Murakowski, and Dennis Prather "Three-dimensional photolithography based on image reversal", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.524654
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KEYWORDS
Picture Archiving and Communication System

Image processing

Optical lithography

Lithography

Absorption

3D image processing

Photoresist materials

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