Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

Deep-UV immersion interferometric lithography

[+] Author Affiliations
Alex K. Raub, Andrew Frauenglass, Steven R. J. Brueck

Univ. of New Mexico (USA)

Will Conley

Motorola (USA)

Ralph R. Dammel, Andy Romano

Clariant Corp. (USA)

Mitsuru Sato

Tokyo Ohka Kogyo Co., Ltd. (Japan)

William Hinsberg

IBM Almaden Research Ctr. (USA)

Proc. SPIE 5377, Optical Microlithography XVII, 306 (May 28, 2004); doi:10.1117/12.536772
Text Size: A A A
From Conference Volume 5377

  • Optical Microlithography XVII
  • Bruce W. Smith
  • Santa Clara, CA | February 22, 2004

abstract

Liquid immersion lithography (LIL) can extend the resolution of optical lithography well beyond today"s capabilities. The half-pitch limit is given by the well-known formula P=λ/(4/NA ), where λ is the optical wavelength and NA =n sin(θ) is the numerical aperture of the exposure device with n the refractive index of the exposure medium. Through the use of exposure media such as purified water (n of 1.44 at 193 nm), it is possible to reduce minimum pitches by a factor of as much as 44% - a full technology node. Beyond this simple observation, there is a good deal of work necessary to fully understand the impact of LIL on a lithography processes. This paper will address issues con-cerning resist chemistry and the impact of water immersion on the imaging capabilities of different resist formulations. All resists were evaluated by imaging dense line-space structures at a 65-nm half-pitch both in air and with water im-mersion. Studies of dense 65-nm lines made by immersion imaging in HPLC grade water with controlled variations in resist components were performed. Significant differences were observed and will be discussed.

© (2004) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Alex K. Raub ; Andrew Frauenglass ; Steven R. J. Brueck ; Will Conley ; Ralph R. Dammel, et al.
"Deep-UV immersion interferometric lithography", Proc. SPIE 5377, Optical Microlithography XVII, 306 (May 28, 2004); doi:10.1117/12.536772; http://dx.doi.org/10.1117/12.536772


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.