Key challenges in across-pitch 0.33-k1 trench patterning using hybrid mask

Navab Singh; Moitreyee Mukherjee-Roy; Sohan S. Mehta; Hideki Suda; Takao Kubota; Yasuki Kimura; Hiroshi Kinoshita

doi:10.1117/12.547729

28 May 2004 Key challenges in across-pitch 0.33-k₁ trench patterning using hybrid mask

Navab Singh, Moitreyee Mukherjee-Roy, Sohan S. Mehta, Hideki Suda, Takao Kubota, Yasuki Kimura, Hiroshi Kinoshita

Proceedings Volume 5377, Optical Microlithography XVII; (2004) https://doi.org/10.1117/12.547729
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

This paper studies the concept of and challenges in patterning trenches using hybrid phase shift mask. Our hybrid mask consists of alternating, chrome-less and 20% attenuated phase shift features on the same reticle. Using this mask, we could pattern across-pitch 120 nm trenches on 0.68-NA, KrF lithography scanner, which is equivalent to K₁ of 0.33. However, many challenging issues like unequal best focus for different duty ratios of the same technique and same duty ratio of different techniques, variation in the dose requirements despite aerial image CD matching and the pitch dependent variation in the critical dimension imbalance of the zero and π phased trenches are observed. These issues, that are question marks on the viability of hybrid mask, are presented in this paper. Hybrid mask manufacturing and characterization data is also included to justify that the issues are not because of the mask manufacturing process.

Citation Download Citation

Navab Singh, Moitreyee Mukherjee-Roy, Sohan S. Mehta, Hideki Suda, Takao Kubota, Yasuki Kimura, and Hiroshi Kinoshita "Key challenges in across-pitch 0.33-k₁ trench patterning using hybrid mask", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); https://doi.org/10.1117/12.547729

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KEYWORDS

Photomasks

Optical lithography

Etching

Modulation

Binary data

Lithography

Phase shifts

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