Laser-based microbonding using hot melt adhesives

G. Hemken; S. Böhm

doi:10.1117/12.808671

24 February 2009 Laser-based microbonding using hot melt adhesives

G. Hemken, S. Böhm

Proceedings Volume 7202, Laser-based Micro- and Nanopackaging and Assembly III; 72020I (2009) https://doi.org/10.1117/12.808671
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

This paper presents an alternative adhesive bonding system which is able to join very small parts as well as relatively large parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to preapply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. The center of micro joining develops suitable joining techniques on the basis of non-viscous adhesive systems (hot melts). The process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production e. g. the laser-sintering of hot melt powder, presents an adapted assembly system and shows an example of an automated assembly process for hot melt coated micro components. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.

Citation Download Citation

G. Hemken and S. Böhm "Laser-based microbonding using hot melt adhesives", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020I (24 February 2009); https://doi.org/10.1117/12.808671

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KEYWORDS

Adhesives

Particles

Microelectromechanical systems

Nanolithography

Printing

Microopto electromechanical systems

Laser cutting

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