Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

EUV lithography for 30nm half pitch and beyond: exploring resolution, sensitivity, and LWR tradeoffs

[+] Author Affiliations
E. Steve Putna, Todd R. Younkin, Manish Chandhok, Kent Frasure

Intel Corp. (USA)

Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72731L (April 01, 2009); doi:10.1117/12.814191
Text Size: A A A
From Conference Volume 7273

  • Advances in Resist Materials and Processing Technology XXVI
  • Clifford L. Henderson
  • San Jose, California, USA | February 22, 2009

abstract

The International Technology Roadmap for Semiconductors (ITRS) denotes Extreme Ultraviolet (EUV) lithography as a leading technology option for realizing the 32nm half-pitch node and beyond. Readiness of EUV materials is currently one high risk area according to assessments made at the 2008 EUVL Symposium. The main development issue regarding EUV resist has been how to simultaneously achieve high sensitivity, high resolution, and low line width roughness (LWR). This paper describes the strategy and current status of EUV resist development at Intel Corporation. Data is presented utilizing Intel's Micro-Exposure Tool (MET) examining the feasibility of establishing a resist process that simultaneously exhibits ≤30nm half-pitch (HP) L/S resolution at ≤10mJ/cm2 with ≤4nm LWR.

© (2009) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

E. Steve Putna ; Todd R. Younkin ; Manish Chandhok and Kent Frasure
"EUV lithography for 30nm half pitch and beyond: exploring resolution, sensitivity, and LWR tradeoffs", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72731L (April 01, 2009); doi:10.1117/12.814191; http://dx.doi.org/10.1117/12.814191


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement


  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.