Diamond micro-milling for array mastering

N. C. R. Holme; T. W. Berg; P. G. Dinesen

doi:10.1117/12.796480

17 September 2008 Diamond micro-milling for array mastering

N. C. R. Holme, T. W. Berg, P. G. Dinesen

Proceedings Volume 7062, Laser Beam Shaping IX; 70620J (2008) https://doi.org/10.1117/12.796480
Event: Optical Engineering + Applications, 2008, San Diego, California, United States

Abstract

We will present recent advances in Kaleido Technology on the ultra-precision diamond-milling process, which is an extremely versatile tool for manufacturing of masters for wafer-based replication technologies. Diamond-milling has the advantage of being able to manufacture lenses with much larger radii of curvatures compared to etching methods. Spherical-, aspherical- and free-form-surfaces have been machined with form accuracies better than 200 nm (PV), arrays up to 50 x 50 mm have been manufactured on wafers, with lens-position accuracies better than 3 μm absolute over the entire wafer.

Citation Download Citation

N. C. R. Holme, T. W. Berg, and P. G. Dinesen "Diamond micro-milling for array mastering", Proc. SPIE 7062, Laser Beam Shaping IX, 70620J (17 September 2008); https://doi.org/10.1117/12.796480

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