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Proceedings Article

Diamond micro-milling for array mastering

[+] Author Affiliations
N. C. R. Holme, T. W. Berg, P. G. Dinesen

Kaleido Technology ApS (Denmark)

Proc. SPIE 7062, Laser Beam Shaping IX, 70620J (September 17, 2008); doi:10.1117/12.796480
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From Conference Volume 7062

  • Laser Beam Shaping IX
  • Andrew Forbes; Todd E. Lizotte
  • San Diego, California, USA | August 10, 2008

abstract

We will present recent advances in Kaleido Technology on the ultra-precision diamond-milling process, which is an extremely versatile tool for manufacturing of masters for wafer-based replication technologies. Diamond-milling has the advantage of being able to manufacture lenses with much larger radii of curvatures compared to etching methods. Spherical-, aspherical- and free-form-surfaces have been machined with form accuracies better than 200 nm (PV), arrays up to 50 x 50 mm have been manufactured on wafers, with lens-position accuracies better than 3 μm absolute over the entire wafer.

© (2008) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

N. C. R. Holme ; T. W. Berg and P. G. Dinesen
"Diamond micro-milling for array mastering", Proc. SPIE 7062, Laser Beam Shaping IX, 70620J (September 17, 2008); doi:10.1117/12.796480; http://dx.doi.org/10.1117/12.796480


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