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Proceedings Article

Impedance-based non-destructive evaluation of the FRP adhesive joints in corrosive environment with re-usable technique

[+] Author Affiliations
S. Na, H. K. Lee

KAIST (Korea, Republic of)

R. Tawie

Univ. Teknologi Mara, Sarawak (Malaysia)

Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 79811B (April 13, 2011); doi:10.1117/12.880655
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From Conference Volume 7981

  • Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011
  • Masayoshi Tomizuka
  • San Diego, California, USA | March 06, 2011

abstract

In this study, a Non-Destructive Evaluation (NDE) method is introduced for evaluating the effects of FRP adhesive joint bond strength subjected to various environmental conditions using electromechanical impedance (EMI) method. The applicability of Fibre Reinforced Plastics (FRP) as a construction material is being globally recognized for their high stiffness and strength to weight ratio and this method proposes a possibility of detecting any strength loss to the adhesive bond without damaging the structure, such as FRP joint itself. PZT (Lead-Zirconate-Titanate) patches were utilized to detect any changes to the bond strength of the FRP adhesive joint exposed to different kinds of environmental conditions by measuring the electrical admittance of the PZT sensors. In addition, a re-usable technique has been introduced with a utilization of magnet to allow multiple sensing of specimens with a single sensor. The results show a possibility of detecting decrease in the bond strength of FRP adhesive using the EMI method.

© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation

S. Na ; R. Tawie and H. K. Lee
"Impedance-based non-destructive evaluation of the FRP adhesive joints in corrosive environment with re-usable technique", Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 79811B (April 13, 2011); doi:10.1117/12.880655; http://dx.doi.org/10.1117/12.880655


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