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Ultrathin HfTaOx gate dielectric has been deposited on Si0.81Ge0.19 by RF co-sputtering of HfO2 and Ta2O5 targets. X-ray
photoelectron spectroscopic (XPS) analyses indicate an interfacial layer containing GeOx, Hf silicate, SiOx (layer of Hf-
Si-Ge-O) formation during deposition of HfTaOx. No evidence of Ta-silicate or Ta incorporation was found at the
interface. X-ray diffraction (GIXRD) measurements show that as-deposited HfTaOx films are amorphous; however, the
crystallization temperature of HfTaOx film is found to increase significantly after annealing beyond 500 °C (for 5 min)
along with the incorporation of Ta (with 18% Ta). It has been found that HfTaOx gate dielectric on Si0.81Ge0.19 exhibit
excellent electrical properties with low interface state density (~6.0×1011 cm-2eV-1) and hysteresis voltage (<70 mV).
Charge trapping/detrapping behavior of the gate stacks has been studied under constant voltage stressing and the
degradation mechanism of the dielectrics has been studied in detail.
S. Mallik,C. Mahata,M. K. Hota,C. K. Sarkar, andC. K. Maiti
"Effects of constant voltage stressing on HfTaOx/SiGe gate stack", Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 854925 (15 October 2012); https://doi.org/10.1117/12.926999
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S. Mallik, C. Mahata, M. K. Hota, C. K. Sarkar, C. K. Maiti, "Effects of constant voltage stressing on HfTaOx/SiGe gate stack," Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 854925 (15 October 2012); https://doi.org/10.1117/12.926999