MAPPER alignment sensor evaluation on process wafers

N. Vergeer; L. Lattard; G. de Boer; F. Couweleers; D. Dave; J. Pradelles; J. Bustos

doi:10.1117/12.2011402

26 March 2013 MAPPER alignment sensor evaluation on process wafers

N. Vergeer, L. Lattard, G. de Boer, F. Couweleers, D. Dave, J. Pradelles, J. Bustos

Proceedings Volume 8680, Alternative Lithographic Technologies V; 86801E (2013) https://doi.org/10.1117/12.2011402
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

MAPPER Lithography is developing a maskless lithography technology based on massively-parallel electron-beam writing. In order to reduce costs and to minimize the footprint of this tool a new alignment sensor has been developed; based on technologies used for DVD optical heads. A wafer with an alignment mark is scanned with the sensor, resulting in an intensity pattern versus position. From this pattern the mark position can be calculated. Evaluations have been made over the performance of this type of sensor using different mark designs at several lithography process steps for FEOL and BEOL manufacturing. It has been shown that sub-nanometer reproducibility (3σ std) of alignment mark readings can be achieved while being robust against various process steps.

Citation Download Citation

N. Vergeer, L. Lattard, G. de Boer, F. Couweleers, D. Dave, J. Pradelles, and J. Bustos "MAPPER alignment sensor evaluation on process wafers", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801E (26 March 2013); https://doi.org/10.1117/12.2011402

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