Directed self-assembly process implementation in a 300mm pilot line environment

Chi-Chun Liu; I. Cristina Estrada-Raygoza; Jassem Abdallah; Steven Holmes; Yunpeng Yin; Anthony Schepis; Michael Cicoria; David Hetzer; Hsinyu Tsai; Michael Guillorn; Melia Tjio; Joy Cheng; Mark Somervell; Matthew Colburn

doi:10.1117/12.2011610

26 March 2013 Directed self-assembly process implementation in a 300mm pilot line environment

Chi-Chun Liu, I. Cristina Estrada-Raygoza, Jassem Abdallah, Steven Holmes, Yunpeng Yin, Anthony Schepis, Michael Cicoria, David Hetzer, Hsinyu Tsai, Michael Guillorn, Melia Tjio, Joy Cheng, Mark Somervell, Matthew Colburn

Author Affiliations +

Proceedings Volume 8680, Alternative Lithographic Technologies V; 86801G (2013) https://doi.org/10.1117/12.2011610
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

The patterning capability of the directed self-assembly (DSA) of a 42nm-pitch block copolymer on an 84nm-pitch guiding pattern was investigated in a 300mm pilot line environment. The chemoepitaxy guiding pattern was created by the IBM Almaden approach using brush materials in combination with an optional chemical slimming of the resist lines. Critical dimension (CD) uniformity, line-edge/line-width roughness (LER/LWR), and lithographic process window (PW) of the DSA process were characterized. CD rectification and LWR reduction were observed. The chemical slimming process was found to be effective in reducing pattern collapse, hence, slightly improving the DSA PW under over-dose conditions. However, the overall PW was found to be smaller than without using the slimming, due to a new failure mode at under-dose region.

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Chi-Chun Liu, I. Cristina Estrada-Raygoza, Jassem Abdallah, Steven Holmes, Yunpeng Yin, Anthony Schepis, Michael Cicoria, David Hetzer, Hsinyu Tsai, Michael Guillorn, Melia Tjio, Joy Cheng, Mark Somervell, and Matthew Colburn "Directed self-assembly process implementation in a 300mm pilot line environment", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801G (26 March 2013); https://doi.org/10.1117/12.2011610

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