Paper
25 July 2013 Selected properties of multi-terminal resistors embedded in printed circuit boards
Adam Kłossowicz, Radosław Kukuła, Paweł Winiarski, Andrzej Dziedzic, Wojciech Stęplewski, Janusz Borecki
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Proceedings Volume 8902, Electron Technology Conference 2013; 89020B (2013) https://doi.org/10.1117/12.2030274
Event: Electron Technology Conference 2013, 2013, Ryn, Poland
Abstract
Modern electronic devices are more and more complex and multifunctional. It could be done by producing faster and more reliable active components and increasing number of passives and interconnections’ density. To form such complex devices one can embed components in substrate of printed circuit board (PCB) or build multilayer boards. The other way is to form multi-terminal passive components to spare free surface and decrease number of interconnections. Authors created three-terminal thin-film (TF) resistors embedded in PCBs and investigated their selected properties such as resistance repeatability, long term stability, pulse durability and thermal characteristics.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Adam Kłossowicz, Radosław Kukuła, Paweł Winiarski, Andrzej Dziedzic, Wojciech Stęplewski, and Janusz Borecki "Selected properties of multi-terminal resistors embedded in printed circuit boards", Proc. SPIE 8902, Electron Technology Conference 2013, 89020B (25 July 2013); https://doi.org/10.1117/12.2030274
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KEYWORDS
Resistance

Resistors

Picosecond phenomena

Temperature metrology

Copper

Nondestructive evaluation

Photovoltaics

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