Development of CMOS-compatible membrane projection lithography

D. Bruce Burckel; Sally Samora; Mike Wiwi; Joel R. Wendt

doi:10.1117/12.2024591

11 September 2013 Development of CMOS-compatible membrane projection lithography

D. Bruce Burckel, Sally Samora, Mike Wiwi, Joel R. Wendt

Proceedings Volume 8806, Metamaterials: Fundamentals and Applications VI; 880613 (2013) https://doi.org/10.1117/12.2024591
Event: SPIE NanoScience + Engineering, 2013, San Diego, California, United States

Abstract

Recently we have demonstrated membrane projection lithography (MPL) as a fabrication approach capable of creating 3D structures with sub-micron metallic inclusions for use in metamaterial and plasmonic applications using polymer material systems. While polymers provide several advantages in processing, they are soft and subject to stress-induced buckling. Furthermore, in next generation active photonic structures, integration of photonic components with CMOS electronics is desirable. While the MPL process flow is conceptually simple, it requires matrix, membrane and backfill materials with orthogonal processing deposition/removal chemistries. By transitioning the MPL process flow into an entirely inorganic material set based around silicon and standard CMOS-compatible materials, several elements of silicon microelectronics can be integrated into photonic devices at the unit-cell scale. This paper will present detailed fabrication and characterization data of these materials, emphasizing the processing trade space as well as optical characterization of the resulting structures.

Citation Download Citation

D. Bruce Burckel, Sally Samora, Mike Wiwi, and Joel R. Wendt "Development of CMOS-compatible membrane projection lithography", Proc. SPIE 8806, Metamaterials: Fundamentals and Applications VI, 880613 (11 September 2013); https://doi.org/10.1117/12.2024591

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