Bursting for enhanced ablation of materials

Sami Hendow; Edward Rea; Nadhir Kosa; Magnus Bengtsson; Sami Shakir

doi:10.1117/12.2036525

7 March 2014 Bursting for enhanced ablation of materials

Sami Hendow, Edward Rea, Nadhir Kosa, Magnus Bengtsson, Sami Shakir

Proceedings Volume 8961, Fiber Lasers XI: Technology, Systems, and Applications; 896110 (2014) https://doi.org/10.1117/12.2036525
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

A significant enhancement in the rate of material removal is demonstrated using a nanosecond-pulsed UV fiber laser in multi-pulsing burst mode, as compared to the case without bursting. Percussion drilling and scribing of thin-film and bulk material tests show that, in general, laser bursts with increased pulse count and reduced pulse spacing show higher rates of material removal. A considerable improvement in removal rate is demonstrated, when bursting is applied to scribing of mono-crystalline silicon (m-Si) and up to 30% in percussion drilling speed. Likewise, improved material removal is demonstrated for scribing of thin film of indium tin oxide (ITO) on glass or metal film on sapphire. Examples of material processing are given with and without bursting at similar experimental conditions of average power, scan speed, and burst/pulse energies. Experimental results included are for m-Si, ITO thin films on glass, and metal films on sapphire.

Citation Download Citation

Sami Hendow, Edward Rea, Nadhir Kosa, Magnus Bengtsson, and Sami Shakir "Bursting for enhanced ablation of materials", Proc. SPIE 8961, Fiber Lasers XI: Technology, Systems, and Applications, 896110 (7 March 2014); https://doi.org/10.1117/12.2036525

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